Showing all 7 results

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  • *NEW* Takano WM-10 Surface Particle Inspection System

    4618
    Manufacturer:
    Takano
    Model:
    WM-10 Particle Inspection System
    Max Wafer:
    300mm
    ID #:
    4618
    Configuration:
    View Details
  • KLA-Tencor Surfscan 6420 Particle Inspection System

    4346
    Manufacturer:
    KLA-Tencor
    Model:
    Surfscan 6420
    Max Wafer:
    200mm
    ID #:
    4346
    Configuration:
    New Laser, New Power Supply, Calibrated to OEM Specifications, Up to 8"/200mm Wafer Capable
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  • Takano Altax 300ex Micro Bump Whole Surface Inspection System

    5039
    Manufacturer:
    Takano
    Model:
    Altax 300ex
    Max Wafer:
    300mm
    ID #:
    5039
    Configuration:
    Unparalleled inspection speed contributes to increased production capacity!  
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  • Takano Vi-4207 R/C Patterned Wafer Visual Inspection System

    5036
    Manufacturer:
    Takano
    Model:
    Vi-4207 R/C
    Max Wafer:
    200mm
    ID #:
    5036
    Configuration:
    Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate  
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  • Takano Vi-4307 M/C Patterned Wafer Visual Inspection System

    5037
    Manufacturer:
    Takano
    Model:
    Vi-4307 M/C
    Max Wafer:
    300mm
    ID #:
    5037
    Configuration:
    Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate 
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  • Takano Vi-5301 M Patterned Wafer Visual Inspection System

    5038
    Manufacturer:
    Takano
    Model:
    Vi-5301 M
    Max Wafer:
    300mm
    ID #:
    5038
    Configuration:
    Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate 
    View Details
  • Takano WM-10R Surface Particle Inspection System

    4974
    Manufacturer:
    Takano
    Model:
    WM-10R Particle Inspection System
    Max Wafer:
    300mm
    ID #:
    4974
    Configuration:
    View Details