Equipment

Showing 1–12 of 182 results

• 

  KLA Tencor F5x Thin Film Measurement System

  5066

  Manufacturer:

  KLA-Tencor

  Model:

  ASET F5x

  Max Wafer:

  300mm

  ID #:

  5066

  Configuration:

  200mm/300mm Wafers, Dual Beam Spectrometry, Positive Pressure Kit

  View Details Request For Quote
• 

  EVG EVG501 Wafer Bonder

  5065

  Manufacturer:

  EVG

  Model:

  EVG501 Wafer Bonder

  Max Wafer:

  ID #:

  5065

  Configuration:

  150mm wafer bonder, configured for thermocompression, fusion, or silicon direct wafer bonding

  View Details Request For Quote
• 

  KLA-Tencor Prometrix RS55/tc Four Point Probe Resistivity Mapping System

  5064

  Manufacturer:

  KLA-Tencor

  Model:

  Prometrix RS55/tc

  Max Wafer:

  200mm

  ID #:

  5064

  Configuration:

  Four Point Probe, 200mm, Temp Compensation, Manual Wafer Handling, Contour Mapping, 3-D Plots

  View Details Request For Quote
• 

  KLA Tencor Surfscan 6200 Particle Inspection System

  5057

  Manufacturer:

  KLA-Tencor

  Model:

  Surfscan 6200

  Max Wafer:

  200mm

  ID #:

  5057

  Configuration:

  200mm Wafers, New Laser, Optics Aligned, New Power Supply, Calibrated to OEM Specs

  View Details Request For Quote
• 

  KLA-Tencor Prometrix UV-1050 Thin Film Measurement System

  5055

  Manufacturer:

  KLA-Tencor

  Model:

  UV-1050

  Max Wafer:

  200mm

  ID #:

  5055

  Configuration:

  150mm-200mm Wafers, Measures Film Thickness 

  View Details Request For Quote
• 

  EVG 520 Wafer Bonder

  5054

  Manufacturer:

  EVG

  Model:

  520 Wafer Bonder

  Max Wafer:

  200mm

  ID #:

  5054

  Configuration:

  Anodic, Fusion & Thermal Compression Bonder, Up to 8"/200mm Wafer Capable, 10 kN Max Bond Force

  View Details Request For Quote
• 

  Perkin Elmer 4400 Sputtering System

  5053

  Manufacturer:

  Perkin Elmer

  Model:

  4400

  Max Wafer:

  ID #:

  5053

  Configuration:

  View Details Request For Quote
• 

  Suss MA6 Mask Aligner

  5052

  Manufacturer:

  Suss

  Model:

  MA6 Mask Aligner

  Max Wafer:

  150mm

  ID #:

  5052

  Configuration:

  View Details Request For Quote
• 

  EVG 520IS Wafer Bonder

  5051

  Manufacturer:

  EVG

  Model:

  520IS Wafer Bonder

  Max Wafer:

  200mm

  ID #:

  5051

  Configuration:

  Anodic, Fusion & Thermal Compression Bonder, Up to 8"/200mm Wafer Capable, 10 kN (20kN upgrade available upon request) 

  View Details Request For Quote
• 

  EVG 520IS Wafer Bonder

  5050

  Manufacturer:

  EVG

  Model:

  520IS Wafer Bonder

  Max Wafer:

  150mm

  ID #:

  5050

  Configuration:

  Anodic, Fusion & Thermal Compression Bonder, Up to 6"/150mm Wafer Capable, 60 kN Max Bond Force

  View Details Request For Quote
• 

  Yield Engineering YES LP3-M5 HMDS Vapor Prime Oven

  5046

  Manufacturer:

  Yield Engineering

  Model:

  YES LP3-M5 HMDS Vapor Prime Oven

  Max Wafer:

  ID #:

  5046

  Configuration:

  Yield Engineering YES LP3-M5

  View Details Request For Quote
• 

  MRL Industries Cyclone Furnace

  5043

  Manufacturer:

  MRL Industries

  Model:

  Cyclone

  Max Wafer:

  ID #:

  5043

  Configuration:

  Qty 4 Chamber Max, Configured for 3 

  View Details Request For Quote