Equipment

Showing 1–12 of 183 results

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  • Takano Altax 300ex Micro Bump Whole Surface Inspection System

    5039
    Manufacturer:
    Takano
    Model:
    Altax 300ex
    Max Wafer:
    300mm
    ID #:
    5039
    Configuration:
    Unparalleled inspection speed contributes to increased production capacity!  
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  • Takano Vi-5301 M Patterned Wafer Visual Inspection System

    5038
    Manufacturer:
    Takano
    Model:
    Vi-5301 M
    Max Wafer:
    300mm
    ID #:
    5038
    Configuration:
    Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate 
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  • Takano Vi-4307 M/C Patterned Wafer Visual Inspection System

    5037
    Manufacturer:
    Takano
    Model:
    Vi-4307 M/C
    Max Wafer:
    300mm
    ID #:
    5037
    Configuration:
    Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate 
    View Details
  • Takano Vi-4207 R/C Patterned Wafer Visual Inspection System

    5036
    Manufacturer:
    Takano
    Model:
    Vi-4207 R/C
    Max Wafer:
    200mm
    ID #:
    5036
    Configuration:
    Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate  
    View Details
  • EVG 501 Wafer Bonder

    5034
    Manufacturer:
    EVG
    Model:
    EVG501 Wafer Bonder
    Max Wafer:
    ID #:
    5034
    Configuration:
    150mm wafer bonder, configured for thermocompression, fusion, or silicon direct wafer bonding
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  • EVG 620 Mask Aligner (Upgraded from a 420)

    5033
    Manufacturer:
    EVG
    Model:
    620 Mask Aligner (Upgraded from a 420)
    Max Wafer:
    150mm
    ID #:
    5033
    Configuration:
    6"/150mm, Top & Backside Side Alignment, 500W Lamphouse
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  • Yield Engineering YES-15F HMDS Oven

    5032
    Manufacturer:
    Yield Engineering
    Model:
    YES-15F HMDS Oven
    Max Wafer:
    ID #:
    5032
    Configuration:
     HMDS Vapor Prime Oven, Dual Function (Prime / Reversal), Up to 200 Degrees Celsius, Chamber Dimensions 16” x 16” x 16”, 8 Heaters (200 Watt Each)
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    Brewer Science / CEE 200 Spin Coater

    5031
    Manufacturer:
    CEE
    Model:
    200
    Max Wafer:
    200mm
    ID #:
    5031
    Configuration:
    CEE 200 Coater
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  • Placeholder

    Brewer Science / CEE 200 Spin Coater

    5030
    Manufacturer:
    CEE
    Model:
    200
    Max Wafer:
    200mm
    ID #:
    5030
    Configuration:
    CEE 200 Coater
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  • KLA-Tencor Alpha-Step IQ Profiler

    5029
    Manufacturer:
    KLA-Tencor
    Model:
    Alpha-Step IQ Profiler
    Max Wafer:
    150mm
    ID #:
    5029
    Configuration:
    6"/150mm Wafer Capable, Measurement Resolution to 1 Angstrom
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  • Suss 350W MJB3 Mask Aligner – SN:

    5028
    Manufacturer:
    Suss
    Model:
    MJB3 Mask Aligner (350W)
    Max Wafer:
    75mm
    ID #:
    5028
    Configuration:
    Topside Alignment, 350W Lamphouse, Splitfield Microscope
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  • OAI MBA 806 Mask Aligner

    5026
    Manufacturer:
    OAI
    Model:
    MBA 806
    Max Wafer:
    150mm
    ID #:
    5026
    Configuration:
    Topside & Backside Alignment, up to 6"/150mm wafer capable, 350W NUV lamphouse, Low-cost R&D mask aligner
    View Details