Showing all 6 results

• 

  *NEW* Takano WM-10 Surface Particle Inspection System

  4618

  Manufacturer:

  Takano

  Model:

  WM-10 Particle Inspection System

  Max Wafer:

  300mm

  ID #:

  4618

  Configuration:

  View Details Request For Quote
• 

  Takano Altax 300ex Micro Bump Whole Surface Inspection System

  5039

  Manufacturer:

  Takano

  Model:

  Altax 300ex

  Max Wafer:

  300mm

  ID #:

  5039

  Configuration:

  Unparalleled inspection speed contributes to increased production capacity!  

  View Details Request For Quote
• 

  Takano Vi-4207 R/C Patterned Wafer Visual Inspection System

  5036

  Manufacturer:

  Takano

  Model:

  Vi-4207 R/C

  Max Wafer:

  200mm

  ID #:

  5036

  Configuration:

  Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate  

  View Details Request For Quote
• 

  Takano Vi-4307 M/C Patterned Wafer Visual Inspection System

  5037

  Manufacturer:

  Takano

  Model:

  Vi-4307 M/C

  Max Wafer:

  300mm

  ID #:

  5037

  Configuration:

  Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate 

  View Details Request For Quote
• 

  Takano Vi-5301 M Patterned Wafer Visual Inspection System

  5038

  Manufacturer:

  Takano

  Model:

  Vi-5301 M

  Max Wafer:

  300mm

  ID #:

  5038

  Configuration:

  Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate 

  View Details Request For Quote
• 

  Takano WM-10R Surface Particle Inspection System

  4974

  Manufacturer:

  Takano

  Model:

  WM-10R Particle Inspection System

  Max Wafer:

  300mm

  ID #:

  4974

  Configuration:

  View Details Request For Quote