Equipment

Showing 1–12 of 191 results

Takano Altax 300ex Micro Bump Whole Surface Inspection System
5039

Manufacturer:

Takano

Model:

Altax 300ex

Max Wafer:

300mm

ID #:

5039

Configuration:

Unparalleled inspection speed contributes to increased production capacity!

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Takano Vi-5301 M Patterned Wafer Visual Inspection System
5038

Manufacturer:

Takano

Model:

Vi-5301 M

Max Wafer:

300mm

ID #:

5038

Configuration:

Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate

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Takano Vi-4307 M/C Patterned Wafer Visual Inspection System
5037

Manufacturer:

Takano

Model:

Vi-4307 M/C

Max Wafer:

300mm

ID #:

5037

Configuration:

Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate

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Takano Vi-4207 R/C Patterned Wafer Visual Inspection System
5036

Manufacturer:

Takano

Model:

Vi-4207 R/C

Max Wafer:

200mm

ID #:

5036

Configuration:

Applications for CMOS Image Sensor, Power Devices, RF Filter, MEMS, Glass, TAIKO WaferHigh reliability based on proven resultsVarious proprietary algorithms to reduce false defectsApplicable on wafers, tape frames, thinned wafers, TAIKO wafers, and glass substratesInner crack detection function after dicingAuto recipe functionAI ADC (AI Auto Defect Classification)Unevenness processing function to separate killer defects from substrate

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SUSS MICROTEC MA8 / BA8 MASK ALIGNER (Gen 3)
4921

Manufacturer:

Suss MicroTec

Model:

MA8/BA8 Mask Aligner

Max Wafer:

200mm

ID #:

4921

Configuration:

200mm wafers, Backside Alignment, 2010 Vintage!

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*NEW* Takano WM-10 Surface Particle Inspection System
4618

Manufacturer:

Takano

Model:

WM-10 Particle Inspection System

Max Wafer:

300mm

ID #:

4618

Configuration:

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*NEW* Takano WM-7SR Surface Particle Inspection System
4617

Manufacturer:

Takano

Model:

WM-7SR Particle Inspection System

Max Wafer:

200mm

ID #:

4617

Configuration:

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Nanotronics Nspec PS Defect Inspection System
5071

Manufacturer:

Nanotronics

Model:

Nspec PS

Max Wafer:

200mm

ID #:

5071

Configuration:

Nanotronics Nspec PS, Aluminum Vacuum Chuck, 100, 150, and 200mm Capable

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Oxford Instruments Plasmalab System 100 ICP 180
5070

Manufacturer:

Oxford

Model:

Plasmalab System 100 ICP 180

Max Wafer:

200mm

ID #:

5070

Configuration:

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KLA-Tencor Surfscan SP1 DLS Unpatterned Surface Inspection System
5069

Manufacturer:

KLA-Tencor

Model:

SP1 DLS

Max Wafer:

300mm

ID #:

5069

Configuration:

Configured for 300mm Wafers, Puck/Vacuum, Open Cassette or Dual FOUP/FIMS Handler200mm/300mm, Puck/Vacuum, Open Cassette or FIM/FOUP HandlerALTERNATIVELY, check out our BRAND NEW WM-10 Takano Surface Particle Inspection Systems: var blink = document.getElementById('blink'); setInterval(function () { blink.style.opacity = (blink.style.opacity == 0 ? 1 : 0);}, 1000); https://classoneequipment.com/product/takano-wm-10-surfsace-particle-inspection-system/">https://classoneequipment.com/product/takano-wm-10-surfsace-particle-inspection-system/

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KLA Tencor F5x Thin Film Measurement System
5066

Manufacturer:

KLA-Tencor

Model:

ASET F5x

Max Wafer:

300mm

ID #:

5066

Configuration:

200mm/300mm Wafers, Dual Beam Spectrometry, Positive Pressure Kit

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EVG EVG501 Wafer Bonder
5065

Manufacturer:

EVG

Model:

EVG501 Wafer Bonder

Max Wafer:

ID #:

5065

Configuration:

150mm wafer bonder, configured for thermocompression, fusion, or silicon direct wafer bonding

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