EVG 501 Wafer Bonder
EVG 501 Wafer Bonder
501 Wafer Bonder
6" Heaters, Standard bond chamber with top and bottom side heaters,
Up to 450°C and 7 kN force
EVG 501 BONDER consisting of:
Model: EV 501
Universal bond chamber control unit
Ergonomically accessible chamber design with top loading
Full process and recipe compatibility to EVG production bonding systems
Handling tool for unloading of hot bond tools
EC Declaration of conformity (Certification done by EVG)
PC Controlled operating environment
Solid state drive and hard drive
Graphical user interface for manual and fully automated bond processing
DVD Backup system: System software and backup tool integrated
MS-Windows based software
Automated recording of process parameters
Storage of files and presets on hard disk or network
Password protected access levels for operator, engineer, and maintenance
Standard bond chamber with top and bottom side heaters
Up to 450°C and 3.5 kN (790 lbf)
Down to 2 mbar abs. pressure
3 Bar abs. pressure
Separate connections for evacuation and vent
Independent temperature controllers for top and bottom side
Electronic pressure regulator for controlled contact force
Increased piston force up to 7kN (1560 lbf)
Resolution: 7N Steps
Pressure disk for 4" wafer:
Material to be defined on order
Compliant layer set
Bond chuck 4" universal:
For mechanically aligned wafer bonding
Allows wafer contact in vacuum
Vacuum equipment with roughing pump:
Evacuation over roughing pump incl connectors and valves for chamber
Gas back fill time < 45 Sec from vacuum to 1 bar absolute pressure
Measurement equipment include vacuum gauge for equipment base pressure to display the chamber vacuum on the PC
Wait command for pressure level
Oil-free roughing pump with a pumping capacity of 3m/h ultimate chamber vacuum 2 mbar abs
Pump down time from ambient to 5 mbar abs. pressure <90s
Earthquake protection device for manual system
Safety precautions to avoid machine sliding due to heavy shock vibrations
Optimized for system weight / size and regional earth risk
Excellent Condition Guaranteed.
Fully Reconditioned to Factory Specifications by ClassOne.
6 Month Warranty and Full Specifications Guarantee.
30 Day Right of Return.
ClassOne Equipment will ship via FedEx, UPS, DHL and/or your desired shipping company. For larger items we will ship via one of our partnered shipping companies who are experienced with handling sensitive semiconductor manufacturing equipment.
All orders are shipped from Atlanta, Georgia USA. Availability and lead-times are based on current conditions and are subject to change depending on in-house demand at time of ordering. We estimate the shipping and delivery dates based on the availability of your parts as well as the shipping options you have chosen. Rush orders will ship the same-day that they are received, if received by 2:30 PM EST. There is a $100.00 USD charge for all rush orders requested. All international shipping import duties and taxes are the responsibility of the purchaser. ClassOne Equipment charges sales tax for items shipped to CA, GA, MI, TX, and MT.
ClassOne Equipment warrants all non-consumable parts for 90 days (unless otherwise stated). This warranty commences upon documented delivery.
This warranty does not apply to defects caused by negligence, improper installation, misuse, unauthorized repair, accident or alteration by the purchaser, or damage during shipping. This warranty does not cover consumable parts. No other warranty is made, expressed or implied, statutory or otherwise.
Please have your Sales Order number or Invoice number available to expedite the return process.
Please note the following important information: (a) all returns must include all original, undamaged items in their original packaging; (b) all items must be in the same condition as received; (c) shipping and handling fees are non-refundable; (d) purchaser is responsible for all return shipping costs (including international shipping import/export duties and taxes).
Returned items must meet ClassOne Equipment inspection standards for credit to be issued.