Used Mask Aligners & Bonders Equipment

ClassOne Equipment is a leader in the development and refurbishment of used high-quality Mask and Bond Aligners used by research, development and production facilities worldwide.

ClassOne Equipment’s used mask and bond alignment systems perform high precision alignment for mask-to-wafer as well as wafer-to-wafer operations. With a wide variety of additional functionality, ClassOne mask aligners not only meet various process requirements but also succeed with their configuration modes.

Our mask aligners and bonders go through a very thorough refurbishment process, so you can trust in the accuracy and reliability of the equipment or system you’re using!

Showing 13–17 of 17 results

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  • EVG 520 Wafer Bonder

    4407
    Manufacturer:
    EVG
    Model:
    520 Wafer Bonder
    Max Wafer:
    150mm
    ID #:
    4407
    Configuration:
    Anodic, Fusion & Thermal Compression Bonder, Up to 6"/150mm Wafer Capable, 20 kN Max Bond Force
    View Details
  • EVG 520IS UV-NIL

    2904
    Manufacturer:
    EVG
    Model:
    520IS UV-NIL
    Max Wafer:
    200mm
    ID #:
    2904
    Configuration:
    200mm Bond Chamber, for UV Cured Adhesive Bonding/Embossing in Vacuum, Like-New Condition!
    View Details
  • EVG EV CS50 Wafer Cooler

    3185
    Manufacturer:
    EVG
    Model:
    CS50 Wafer Cooler
    Max Wafer:
    150mm
    ID #:
    3185
    Configuration:
    EVG EV CS50 Wafer Cooler
    View Details
  • EVG 620 Manual Mask Aligner

    4361
    Manufacturer:
    EVG
    Model:
    620 Mask Aligner
    Max Wafer:
    150mm
    ID #:
    4361
    Configuration:
    6"/150mm, Top Side Alignment, 500W Lamphouse
    View Details
  • EVG 620 Manual Mask Aligner

    4365
    Manufacturer:
    EVG
    Model:
    620 Mask Aligner
    Max Wafer:
    150mm
    ID #:
    4365
    Configuration:
    6"/150mm, Top & Backside Side Alignment, 500W Lamphouse
    View Details