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Home ›  Process Equipment › Dicing Systems

Dicing Systems

	Manufacturer	Model	Configuration	Price
	Disco	2H/6T Dicing Saw	Manual Dicing Saw, up to 6""/150mm capable, ideal for R&D applications	CALL
	Disco	DAD-321 Dicing Saw	Setup for 6""/150mm Wafers, 1.5kW Synchro Spindle, 40mm Scope With Eyepiece	CALL
	Disco	DAD-341 Dicing Saw	Non Contact Setup, Motorized 380° Theta, 8"" universal chuck table	CALL
	Disco	DFD-6361 Dicing Saw	Fully Automatic Dicing Saw, up to 300mm, Dual Spindle	CALL
	Disco	DFD-651 Dicing Saw	Fully Automatic Dicing Saw, Non Contact Setup, Broken Blade Detector, up to 8""/200mm capable	CALL
	K&S	7100 Dicing Saw	Automatic Dicing Saw, 4"" chuck installed, up to 8""/200mm capable, 2"" Spindle	CALL
	K&S	780-6 Dicing Saw	2"" Spindle, 6"" Pourous Chuck, CCD Camera, 200x	CALL
	K&S	960-6 Wafer Mounting System	Wafer Mounter, up to 6""/150mm wafer capable	CALL
	Karl Suss	RA120M Scriber	Automatic Wafer Scriber, up to 4""/100mm wafer capable	CALL